Self-alignment for redistribution layer

Self-alignment for redistribution layer

An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs eac...

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Hauptverfasser: Yang Ku-Feng, Chung Ming-Tsu, Wu Tsang-Jiuh, Shih Hong-Ye, Wu Jiung, Tsai Chen-Yu, Chen Hsin-Yu, Chiou Wen-Chih
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Yang Ku-Feng
Chung Ming-Tsu
Wu Tsang-Jiuh
Shih Hong-Ye
Wu Jiung
Tsai Chen-Yu
Chen Hsin-Yu
Chiou Wen-Chih
description An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs each extend through the substrate and electrically connect to the electronic devices. A redistribution layer (RDL) formed on the second side of the substrate interconnects ones of the dummy TSVs with ones of the functional TSVs. Step heights of the RDL over the functional TSVs are less than a predetermined value, whereas step heights of the RDL over the dummy TSVs are greater than the predetermined value.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Self-alignment for redistribution layer
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