Methods of fabricating micro electro mechanical system structures

A method of fabricating a micro electro mechanical system (MEMS) structure includes providing a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is provided and bonded with the bonding pad structure o...

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Bibliographische Detailangaben
Hauptverfasser:	Chiu Yi Hsun, Ni Chyi-Tsong, Su Ching-Hou, Chien Ting-Ying
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	A method of fabricating a micro electro mechanical system (MEMS) structure includes providing a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is provided and bonded with the bonding pad structure of the first substrate structure.