Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods and apparatus

A reconstruction process includes measuring structures formed on a substrate by a lithographic process, determining a reconstruction model for generating modeled patterns, computing and minimizing a multi-variable cost function including model errors. Errors induced by nuisance parameters are modele...

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Hauptverfasser:	Brok Janne Maria, Mink Martijn Peter, Setija Irwan Dani
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING
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creator	Brok Janne Maria Mink Martijn Peter Setija Irwan Dani
description	A reconstruction process includes measuring structures formed on a substrate by a lithographic process, determining a reconstruction model for generating modeled patterns, computing and minimizing a multi-variable cost function including model errors. Errors induced by nuisance parameters are modeled based on statistical description of the nuisance parameters' behavior, described by probability density functions. From the statistical description model errors are calculated expressed in terms of average model errors and weighing matrices. These are used to modify the cost function so as to reduce the influence of the nuisance parameters in the reconstruction, without increasing the complexity of the reconstruction model. The nuisance parameters may be parameters of the modeled structure, and/or parameters of an inspection apparatus used in the reconstruction.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9772562B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9772562B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9772562B23</originalsourceid><addsrcrecordid>eNqNTjEOwjAM7MKAgD_4AWUpgooVBGJhAubKpKat1MSR4zyIn5KoLGwM9tnWne_mxftK2nML6FJ5j4IaA7xYwBKGKIPrACGoRKNRCNjlNT7TBZVKsNzSOAlIJHXDImR0YFem2fqoJOCFO0GbsU2PJv5g_UiWnGaPEE2fLHOW8BtmWcxeOAZafXFRwPl0P17W5Lmh4NGQI20et31dV9tddag2f1A-ZWNWZQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods and apparatus</title><source>esp@cenet</source><creator>Brok Janne Maria ; Mink Martijn Peter ; Setija Irwan Dani</creator><creatorcontrib>Brok Janne Maria ; Mink Martijn Peter ; Setija Irwan Dani</creatorcontrib><description>A reconstruction process includes measuring structures formed on a substrate by a lithographic process, determining a reconstruction model for generating modeled patterns, computing and minimizing a multi-variable cost function including model errors. Errors induced by nuisance parameters are modeled based on statistical description of the nuisance parameters' behavior, described by probability density functions. From the statistical description model errors are calculated expressed in terms of average model errors and weighing matrices. These are used to modify the cost function so as to reduce the influence of the nuisance parameters in the reconstruction, without increasing the complexity of the reconstruction model. The nuisance parameters may be parameters of the modeled structure, and/or parameters of an inspection apparatus used in the reconstruction.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; TESTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170926&DB=EPODOC&CC=US&NR=9772562B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170926&DB=EPODOC&CC=US&NR=9772562B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Brok Janne Maria</creatorcontrib><creatorcontrib>Mink Martijn Peter</creatorcontrib><creatorcontrib>Setija Irwan Dani</creatorcontrib><title>Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods and apparatus</title><description>A reconstruction process includes measuring structures formed on a substrate by a lithographic process, determining a reconstruction model for generating modeled patterns, computing and minimizing a multi-variable cost function including model errors. Errors induced by nuisance parameters are modeled based on statistical description of the nuisance parameters' behavior, described by probability density functions. From the statistical description model errors are calculated expressed in terms of average model errors and weighing matrices. These are used to modify the cost function so as to reduce the influence of the nuisance parameters in the reconstruction, without increasing the complexity of the reconstruction model. The nuisance parameters may be parameters of the modeled structure, and/or parameters of an inspection apparatus used in the reconstruction.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNTjEOwjAM7MKAgD_4AWUpgooVBGJhAubKpKat1MSR4zyIn5KoLGwM9tnWne_mxftK2nML6FJ5j4IaA7xYwBKGKIPrACGoRKNRCNjlNT7TBZVKsNzSOAlIJHXDImR0YFem2fqoJOCFO0GbsU2PJv5g_UiWnGaPEE2fLHOW8BtmWcxeOAZafXFRwPl0P17W5Lmh4NGQI20et31dV9tddag2f1A-ZWNWZQ</recordid><startdate>20170926</startdate><enddate>20170926</enddate><creator>Brok Janne Maria</creator><creator>Mink Martijn Peter</creator><creator>Setija Irwan Dani</creator><scope>EVB</scope></search><sort><creationdate>20170926</creationdate><title>Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods and apparatus</title><author>Brok Janne Maria ; Mink Martijn Peter ; Setija Irwan Dani</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9772562B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Brok Janne Maria</creatorcontrib><creatorcontrib>Mink Martijn Peter</creatorcontrib><creatorcontrib>Setija Irwan Dani</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Brok Janne Maria</au><au>Mink Martijn Peter</au><au>Setija Irwan Dani</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods and apparatus</title><date>2017-09-26</date><risdate>2017</risdate><abstract>A reconstruction process includes measuring structures formed on a substrate by a lithographic process, determining a reconstruction model for generating modeled patterns, computing and minimizing a multi-variable cost function including model errors. Errors induced by nuisance parameters are modeled based on statistical description of the nuisance parameters' behavior, described by probability density functions. From the statistical description model errors are calculated expressed in terms of average model errors and weighing matrices. These are used to modify the cost function so as to reduce the influence of the nuisance parameters in the reconstruction, without increasing the complexity of the reconstruction model. The nuisance parameters may be parameters of the modeled structure, and/or parameters of an inspection apparatus used in the reconstruction.</abstract><oa>free_for_read</oa></addata></record>
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subjects	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING
title	Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods and apparatus
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