Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly can include a first known good packaged microelectronic device including a first interposer substrate. A first die and a first through-casing...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee Choon Kuan, Chong Chin Hui, Corisis David J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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