Wafer rigidity with reinforcement structure

Reinforcement structures used with a thinned wafer and methods of manufacture are provided. The method includes forming trenches or vias at least partially through a backside of a thinned wafer attached to a carrier wafer. The method further includes depositing material within the trenches or vias t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Filippi Ronald G, Kim Andrew T, Kaltalioglu Erdem, Wang Ping-Chuan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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