Package formation method and MEMS package

This invention includes a sacrificial thin film formation step for chemical-mechanical polishing a temporary substrate made of a readily polishable material and sputtering a metal thin film along the smoothly polished surface, and a first bonding step for forming a sealing frame obtained by bringing...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Maeda Atsuhiko, Kurashima Yuuichi, Takagi Hideki
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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