Intra-field process control for lithography

In some embodiments, the present application is directed to a method and system for process control of a lithography tool. The method transfers a reference pattern to exposure fields of a reference workpiece to form pairs of overlapping reference layers. Misalignment between the overlapping referenc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tsen Yen-Di, Lu Shin-Rung, Hung Ai-Jen, Huang Chen-Yen
Format: Patent
Sprache:eng
Schlagworte:
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