Solder assembly temperature monitoring process

A method includes providing a printed circuit board ("PCB") supporting a solderable component, and supporting a first fuse on the PCB, where the first fuse includes a first temperature-sensitive element that measurably changes in response to exposure to ambient thermal conditions exceeding...

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Bibliographische Detailangaben
Hauptverfasser:	Hugo Stephen Michael, Kelly Matthew Stephen
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS GENERATION MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR TRANSPORTING WELDING WORKING BY LASER BEAM
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