Electronic component
A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled...
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creator | Toi Takaomi Katsuta Mizuho Marusawa Hiroshi Ishida Kosuke |
description | A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin. The soft magnetic metal powder has an average particle size of 12 μm or less. The magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9711270B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9711270B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9711270B23</originalsourceid><addsrcrecordid>eNrjZBBxzUlNLinKz8tMVkjOzy3Iz0vNK-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwZbmhoZG5gZORsZEKAEAJ30gvg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic component</title><source>esp@cenet</source><creator>Toi Takaomi ; Katsuta Mizuho ; Marusawa Hiroshi ; Ishida Kosuke</creator><creatorcontrib>Toi Takaomi ; Katsuta Mizuho ; Marusawa Hiroshi ; Ishida Kosuke</creatorcontrib><description>A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin. The soft magnetic metal powder has an average particle size of 12 μm or less. The magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170718&DB=EPODOC&CC=US&NR=9711270B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170718&DB=EPODOC&CC=US&NR=9711270B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Toi Takaomi</creatorcontrib><creatorcontrib>Katsuta Mizuho</creatorcontrib><creatorcontrib>Marusawa Hiroshi</creatorcontrib><creatorcontrib>Ishida Kosuke</creatorcontrib><title>Electronic component</title><description>A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin. The soft magnetic metal powder has an average particle size of 12 μm or less. The magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxzUlNLinKz8tMVkjOzy3Iz0vNK-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwZbmhoZG5gZORsZEKAEAJ30gvg</recordid><startdate>20170718</startdate><enddate>20170718</enddate><creator>Toi Takaomi</creator><creator>Katsuta Mizuho</creator><creator>Marusawa Hiroshi</creator><creator>Ishida Kosuke</creator><scope>EVB</scope></search><sort><creationdate>20170718</creationdate><title>Electronic component</title><author>Toi Takaomi ; Katsuta Mizuho ; Marusawa Hiroshi ; Ishida Kosuke</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9711270B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>Toi Takaomi</creatorcontrib><creatorcontrib>Katsuta Mizuho</creatorcontrib><creatorcontrib>Marusawa Hiroshi</creatorcontrib><creatorcontrib>Ishida Kosuke</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Toi Takaomi</au><au>Katsuta Mizuho</au><au>Marusawa Hiroshi</au><au>Ishida Kosuke</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic component</title><date>2017-07-18</date><risdate>2017</risdate><abstract>A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin. The soft magnetic metal powder has an average particle size of 12 μm or less. The magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS |
title | Electronic component |
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