Waterfall wire bonding

A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chiu Chin Tien, Yu Cheeman, Lu Zhong, Yu Fen, Xiao Fuqiang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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