Wiring substrate and method of making wiring substrate

A wiring substrate includes a core layer having a penetrating hole, a first insulating layer disposed on a first surface of the core layer and having a first opening at a position of the penetrating hole, the first insulating layer containing no filler, a penetrating electrode disposed in the penetr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shimizu Noriyoshi, Furuichi Jun
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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