Semiconductor devices with vertical field floating rings and methods of fabrication thereof
A semiconductor device includes a semiconductor substrate having a first conductivity type. A gate structure is supported by a surface of the semiconductor substrate, and a current carrying region (e.g., a drain region of an LDMOS transistor) is disposed in the semiconductor substrate at the surface...
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creator | Gao Zihao M Burdeaux David C |
description | A semiconductor device includes a semiconductor substrate having a first conductivity type. A gate structure is supported by a surface of the semiconductor substrate, and a current carrying region (e.g., a drain region of an LDMOS transistor) is disposed in the semiconductor substrate at the surface. The device further includes a drift region of a second, opposite conductivity type disposed in the semiconductor substrate at the surface. The drift region extends laterally from the current carrying region to the gate structure. The device further includes a buried region of the second conductivity type disposed in the semiconductor substrate below the current carrying region. The buried region is vertically aligned with the current carrying region, and a portion of the semiconductor substrate with the first conductivity type is present between the buried region and the current carrying region. |
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A gate structure is supported by a surface of the semiconductor substrate, and a current carrying region (e.g., a drain region of an LDMOS transistor) is disposed in the semiconductor substrate at the surface. The device further includes a drift region of a second, opposite conductivity type disposed in the semiconductor substrate at the surface. The drift region extends laterally from the current carrying region to the gate structure. The device further includes a buried region of the second conductivity type disposed in the semiconductor substrate below the current carrying region. The buried region is vertically aligned with the current carrying region, and a portion of the semiconductor substrate with the first conductivity type is present between the buried region and the current carrying region.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170530&DB=EPODOC&CC=US&NR=9666710B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170530&DB=EPODOC&CC=US&NR=9666710B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gao Zihao M</creatorcontrib><creatorcontrib>Burdeaux David C</creatorcontrib><title>Semiconductor devices with vertical field floating rings and methods of fabrication thereof</title><description>A semiconductor device includes a semiconductor substrate having a first conductivity type. 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A gate structure is supported by a surface of the semiconductor substrate, and a current carrying region (e.g., a drain region of an LDMOS transistor) is disposed in the semiconductor substrate at the surface. The device further includes a drift region of a second, opposite conductivity type disposed in the semiconductor substrate at the surface. The drift region extends laterally from the current carrying region to the gate structure. The device further includes a buried region of the second conductivity type disposed in the semiconductor substrate below the current carrying region. The buried region is vertically aligned with the current carrying region, and a portion of the semiconductor substrate with the first conductivity type is present between the buried region and the current carrying region.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Semiconductor devices with vertical field floating rings and methods of fabrication thereof |
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