Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein ea...
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| creator | Murugan Rajen Manicon Gupta Chittranjan Mohan Trombley Django Earl Mi Minhong Morrison Gary Paul Rhyner Kenneth Robert Beddingfield Stanley Craig Chen Jie |
| description | A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip. |
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The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170530&DB=EPODOC&CC=US&NR=9666553B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170530&DB=EPODOC&CC=US&NR=9666553B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Murugan Rajen Manicon</creatorcontrib><creatorcontrib>Gupta Chittranjan Mohan</creatorcontrib><creatorcontrib>Trombley Django Earl</creatorcontrib><creatorcontrib>Mi Minhong</creatorcontrib><creatorcontrib>Morrison Gary Paul</creatorcontrib><creatorcontrib>Rhyner Kenneth Robert</creatorcontrib><creatorcontrib>Beddingfield Stanley Craig</creatorcontrib><creatorcontrib>Chen Jie</creatorcontrib><title>Millimeter wave integrated circuit with ball grid array package including transmit and receive channels</title><description>A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzDEKwlAMgOEuDqLeIRdwsbTgqiguTuos8b34GkxjyUst3t4KHsDpXz7-aZGOLMItORkM-CJgdUqGThECW-jZYWBv4IYikIwjoBm-ocPwwPT1QfrImsANNbejR41gFIjHXWhQlSTPi8kdJdPi11kB-915e1hS97xSHm-k5NfLaV3XdVWVm1X5B_kAdllAKg</recordid><startdate>20170530</startdate><enddate>20170530</enddate><creator>Murugan Rajen Manicon</creator><creator>Gupta Chittranjan Mohan</creator><creator>Trombley Django Earl</creator><creator>Mi Minhong</creator><creator>Morrison Gary Paul</creator><creator>Rhyner Kenneth Robert</creator><creator>Beddingfield Stanley Craig</creator><creator>Chen Jie</creator><scope>EVB</scope></search><sort><creationdate>20170530</creationdate><title>Millimeter wave integrated circuit with ball grid array package including transmit and receive channels</title><author>Murugan Rajen Manicon ; Gupta Chittranjan Mohan ; Trombley Django Earl ; Mi Minhong ; Morrison Gary Paul ; Rhyner Kenneth Robert ; Beddingfield Stanley Craig ; Chen Jie</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9666553B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Murugan Rajen Manicon</creatorcontrib><creatorcontrib>Gupta Chittranjan Mohan</creatorcontrib><creatorcontrib>Trombley Django Earl</creatorcontrib><creatorcontrib>Mi Minhong</creatorcontrib><creatorcontrib>Morrison Gary Paul</creatorcontrib><creatorcontrib>Rhyner Kenneth Robert</creatorcontrib><creatorcontrib>Beddingfield Stanley Craig</creatorcontrib><creatorcontrib>Chen Jie</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Murugan Rajen Manicon</au><au>Gupta Chittranjan Mohan</au><au>Trombley Django Earl</au><au>Mi Minhong</au><au>Morrison Gary Paul</au><au>Rhyner Kenneth Robert</au><au>Beddingfield Stanley Craig</au><au>Chen Jie</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Millimeter wave integrated circuit with ball grid array package including transmit and receive channels</title><date>2017-05-30</date><risdate>2017</risdate><abstract>A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
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