Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor
A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and includin...
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| creator | Kaneko Masahiro Shimabe Toyotaka Furutani Toshiki Shimizu Naoki Tashima Takeshi Shimada Yasuyuki |
| description | A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 μm to 200 μm and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%. |
| format | Patent |
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The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 μm to 200 μm and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170516&DB=EPODOC&CC=US&NR=9655249B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170516&DB=EPODOC&CC=US&NR=9655249B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kaneko Masahiro</creatorcontrib><creatorcontrib>Shimabe Toyotaka</creatorcontrib><creatorcontrib>Furutani Toshiki</creatorcontrib><creatorcontrib>Shimizu Naoki</creatorcontrib><creatorcontrib>Tashima Takeshi</creatorcontrib><creatorcontrib>Shimada Yasuyuki</creatorcontrib><title>Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor</title><description>A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 μm to 200 μm and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgILk0qLilKLElVKM8syVBIKs3MKdHNzFNITixITM4syS9SSMxLUchNLcnIT1FIA3JzE_NK0xKTS0qLMvPSFYoJaedhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQFWpeakl8aHBlmampkYmlk5GxkQoAQCbWz2-</recordid><startdate>20170516</startdate><enddate>20170516</enddate><creator>Kaneko Masahiro</creator><creator>Shimabe Toyotaka</creator><creator>Furutani Toshiki</creator><creator>Shimizu Naoki</creator><creator>Tashima Takeshi</creator><creator>Shimada Yasuyuki</creator><scope>EVB</scope></search><sort><creationdate>20170516</creationdate><title>Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor</title><author>Kaneko Masahiro ; Shimabe Toyotaka ; Furutani Toshiki ; Shimizu Naoki ; Tashima Takeshi ; Shimada Yasuyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9655249B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kaneko Masahiro</creatorcontrib><creatorcontrib>Shimabe Toyotaka</creatorcontrib><creatorcontrib>Furutani Toshiki</creatorcontrib><creatorcontrib>Shimizu Naoki</creatorcontrib><creatorcontrib>Tashima Takeshi</creatorcontrib><creatorcontrib>Shimada Yasuyuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kaneko Masahiro</au><au>Shimabe Toyotaka</au><au>Furutani Toshiki</au><au>Shimizu Naoki</au><au>Tashima Takeshi</au><au>Shimada Yasuyuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor</title><date>2017-05-16</date><risdate>2017</risdate><abstract>A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 μm to 200 μm and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor |
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