Method for modifying the crystalline structure of a copper element

A method for modifying crystalline structure of a copper element with a planar surface, including: a) producing a copper standard having large grains, wherein the standard includes a planar surface, b) reducing roughness of the planar surfaces to a roughness of less than 1 nm, c) cleaning the planar...

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Hauptverfasser: Gueguen Pierric, Rivoire Maurice, Di Cioccio Lea
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creator Gueguen Pierric
Rivoire Maurice
Di Cioccio Lea
description A method for modifying crystalline structure of a copper element with a planar surface, including: a) producing a copper standard having large grains, wherein the standard includes a planar surface, b) reducing roughness of the planar surfaces to a roughness of less than 1 nm, c) cleaning the planar surfaces, d) bringing the two planar surfaces into contact, and e) annealing.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9620412B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9620412B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9620412B23</originalsourceid><addsrcrecordid>eNqNyrEKwjAQBuAsDqK-w72AoFEE10qLi5M6l5D-sYE0Fy7XoW_v4gM4fcu3Ns0DOvJAgYUmHmJYYv6QjiAvS1WXUsygqjJ7nQXEgRx5LgVCSJiQdWtWwaWK3c-Noa593e57FO5Ri_PI0P79vF7s4Xy0jT39Ub76jjH-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for modifying the crystalline structure of a copper element</title><source>esp@cenet</source><creator>Gueguen Pierric ; Rivoire Maurice ; Di Cioccio Lea</creator><creatorcontrib>Gueguen Pierric ; Rivoire Maurice ; Di Cioccio Lea</creatorcontrib><description>A method for modifying crystalline structure of a copper element with a planar surface, including: a) producing a copper standard having large grains, wherein the standard includes a planar surface, b) reducing roughness of the planar surfaces to a roughness of less than 1 nm, c) cleaning the planar surfaces, d) bringing the two planar surfaces into contact, and e) annealing.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; METALLURGY ; SEMICONDUCTOR DEVICES ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170411&amp;DB=EPODOC&amp;CC=US&amp;NR=9620412B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170411&amp;DB=EPODOC&amp;CC=US&amp;NR=9620412B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gueguen Pierric</creatorcontrib><creatorcontrib>Rivoire Maurice</creatorcontrib><creatorcontrib>Di Cioccio Lea</creatorcontrib><title>Method for modifying the crystalline structure of a copper element</title><description>A method for modifying crystalline structure of a copper element with a planar surface, including: a) producing a copper standard having large grains, wherein the standard includes a planar surface, b) reducing roughness of the planar surfaces to a roughness of less than 1 nm, c) cleaning the planar surfaces, d) bringing the two planar surfaces into contact, and e) annealing.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQBuAsDqK-w72AoFEE10qLi5M6l5D-sYE0Fy7XoW_v4gM4fcu3Ns0DOvJAgYUmHmJYYv6QjiAvS1WXUsygqjJ7nQXEgRx5LgVCSJiQdWtWwaWK3c-Noa593e57FO5Ri_PI0P79vF7s4Xy0jT39Ub76jjH-</recordid><startdate>20170411</startdate><enddate>20170411</enddate><creator>Gueguen Pierric</creator><creator>Rivoire Maurice</creator><creator>Di Cioccio Lea</creator><scope>EVB</scope></search><sort><creationdate>20170411</creationdate><title>Method for modifying the crystalline structure of a copper element</title><author>Gueguen Pierric ; Rivoire Maurice ; Di Cioccio Lea</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9620412B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>Gueguen Pierric</creatorcontrib><creatorcontrib>Rivoire Maurice</creatorcontrib><creatorcontrib>Di Cioccio Lea</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Gueguen Pierric</au><au>Rivoire Maurice</au><au>Di Cioccio Lea</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for modifying the crystalline structure of a copper element</title><date>2017-04-11</date><risdate>2017</risdate><abstract>A method for modifying crystalline structure of a copper element with a planar surface, including: a) producing a copper standard having large grains, wherein the standard includes a planar surface, b) reducing roughness of the planar surfaces to a roughness of less than 1 nm, c) cleaning the planar surfaces, d) bringing the two planar surfaces into contact, and e) annealing.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
SEMICONDUCTOR DEVICES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
title Method for modifying the crystalline structure of a copper element
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T13%3A36%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Gueguen%20Pierric&rft.date=2017-04-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9620412B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true