Integrated circuits including modified liners and methods for fabricating the same

Integrated circuits and methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes contacting a liner that is disposed adjacent to a porous interlayer dielectric (ILD) layer of dielectric material with a selectively reactive gas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ryan Errol Todd, Zhang Xunyuan
Format: Patent
Sprache:eng
Schlagworte:
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