Closed-loop cooling system for high-density clustered computer system
A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and on...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Dean Steven J Franz Perry D McCann Timothy Scott Glanzman Jeffrey M Collins David R |
description | A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9606588B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9606588B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9606588B23</originalsourceid><addsrcrecordid>eNrjZHB1zskvTk3RzcnPL1BIzs_PycxLVyiuLC5JzVVIyy9SyMhMz9BNSc0rziypVEjOKQVKFKWmAFXmFpQCmVClPAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7UkPjTY0szAzNTCwsnImAglANb7M7Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Closed-loop cooling system for high-density clustered computer system</title><source>esp@cenet</source><creator>Dean Steven J ; Franz Perry D ; McCann Timothy Scott ; Glanzman Jeffrey M ; Collins David R</creator><creatorcontrib>Dean Steven J ; Franz Perry D ; McCann Timothy Scott ; Glanzman Jeffrey M ; Collins David R</creatorcontrib><description>A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170328&DB=EPODOC&CC=US&NR=9606588B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170328&DB=EPODOC&CC=US&NR=9606588B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Dean Steven J</creatorcontrib><creatorcontrib>Franz Perry D</creatorcontrib><creatorcontrib>McCann Timothy Scott</creatorcontrib><creatorcontrib>Glanzman Jeffrey M</creatorcontrib><creatorcontrib>Collins David R</creatorcontrib><title>Closed-loop cooling system for high-density clustered computer system</title><description>A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INFORMATION STORAGE</subject><subject>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1zskvTk3RzcnPL1BIzs_PycxLVyiuLC5JzVVIyy9SyMhMz9BNSc0rziypVEjOKQVKFKWmAFXmFpQCmVClPAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7UkPjTY0szAzNTCwsnImAglANb7M7Y</recordid><startdate>20170328</startdate><enddate>20170328</enddate><creator>Dean Steven J</creator><creator>Franz Perry D</creator><creator>McCann Timothy Scott</creator><creator>Glanzman Jeffrey M</creator><creator>Collins David R</creator><scope>EVB</scope></search><sort><creationdate>20170328</creationdate><title>Closed-loop cooling system for high-density clustered computer system</title><author>Dean Steven J ; Franz Perry D ; McCann Timothy Scott ; Glanzman Jeffrey M ; Collins David R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9606588B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INFORMATION STORAGE</topic><topic>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Dean Steven J</creatorcontrib><creatorcontrib>Franz Perry D</creatorcontrib><creatorcontrib>McCann Timothy Scott</creatorcontrib><creatorcontrib>Glanzman Jeffrey M</creatorcontrib><creatorcontrib>Collins David R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Dean Steven J</au><au>Franz Perry D</au><au>McCann Timothy Scott</au><au>Glanzman Jeffrey M</au><au>Collins David R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Closed-loop cooling system for high-density clustered computer system</title><date>2017-03-28</date><risdate>2017</risdate><abstract>A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US9606588B2 |
source | esp@cenet |
subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
title | Closed-loop cooling system for high-density clustered computer system |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T01%3A32%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Dean%20Steven%20J&rft.date=2017-03-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9606588B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |