Combined audio jack and mobile electronic device enclosure

Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack...

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Hauptverfasser: Sloey Jason S, Woodhull Charles B
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creator Sloey Jason S
Woodhull Charles B
description Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9601882B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9601882B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9601882B23</originalsourceid><addsrcrecordid>eNrjZLByzs9NysxLTVFILE3JzFfISkzOVkjMS1HIzU_KzElVSM1JTS4pys_LTFZISS3LTAaK5CXn5BeXFqXyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JL40GBLMwNDCwsjJyNjIpQAAAXiLrY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Combined audio jack and mobile electronic device enclosure</title><source>esp@cenet</source><creator>Sloey Jason S ; Woodhull Charles B</creator><creatorcontrib>Sloey Jason S ; Woodhull Charles B</creatorcontrib><description>Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170321&amp;DB=EPODOC&amp;CC=US&amp;NR=9601882B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170321&amp;DB=EPODOC&amp;CC=US&amp;NR=9601882B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Sloey Jason S</creatorcontrib><creatorcontrib>Woodhull Charles B</creatorcontrib><title>Combined audio jack and mobile electronic device enclosure</title><description>Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLByzs9NysxLTVFILE3JzFfISkzOVkjMS1HIzU_KzElVSM1JTS4pys_LTFZISS3LTAaK5CXn5BeXFqXyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JL40GBLMwNDCwsjJyNjIpQAAAXiLrY</recordid><startdate>20170321</startdate><enddate>20170321</enddate><creator>Sloey Jason S</creator><creator>Woodhull Charles B</creator><scope>EVB</scope></search><sort><creationdate>20170321</creationdate><title>Combined audio jack and mobile electronic device enclosure</title><author>Sloey Jason S ; Woodhull Charles B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9601882B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>Sloey Jason S</creatorcontrib><creatorcontrib>Woodhull Charles B</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sloey Jason S</au><au>Woodhull Charles B</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Combined audio jack and mobile electronic device enclosure</title><date>2017-03-21</date><risdate>2017</risdate><abstract>Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TELEPHONIC COMMUNICATION
title Combined audio jack and mobile electronic device enclosure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T17%3A59%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Sloey%20Jason%20S&rft.date=2017-03-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9601882B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true