Module board

To provide a module board capable of suppressing depression of a top face of insulating resin near the center of a substrate by arranging multiple columnar connection terminals not only on a peripheral area of the substrate but also between multiple electronic components that are mounted. Multiple e...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Mizushiro Masaaki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!