Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

A semiconductor device is made by forming solder bumps over a copper carrier. Solder capture indentations are formed in the copper carrier to receive the solder bumps. A semiconductor die is mounted to the copper carrier using a die attach adhesive. The semiconductor die has contact pads formed over...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tay Lionel Chien Hui, Bathan Henry D, Merilo Dioscoro A, Punzalan Jeffrey D, Camacho Zigmund R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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