Photoresist overcoat compositions
Photoresist overcoat compositions are provided. The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat c...
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| creator | DeSisto Jason A Liu Cong Park Jong Keun Caporale Stefan J Xu Cheng-Bai Lee Choong-Bong Andes Cecily |
| description | Photoresist overcoat compositions are provided. The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition. The compositions have particular applicability in the semiconductor manufacturing industry for use in negative tone development processes. |
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The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition. The compositions have particular applicability in the semiconductor manufacturing industry for use in negative tone development processes.</description><language>eng</language><subject>ADHESIVES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; CINEMATOGRAPHY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTROGRAPHY ; FILLING PASTES ; HOLOGRAPHY ; INKS ; MATERIALS THEREFOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORIGINALS THEREFOR ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; POLISHES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170228&DB=EPODOC&CC=US&NR=9581904B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170228&DB=EPODOC&CC=US&NR=9581904B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DeSisto Jason A</creatorcontrib><creatorcontrib>Liu Cong</creatorcontrib><creatorcontrib>Park Jong Keun</creatorcontrib><creatorcontrib>Caporale Stefan J</creatorcontrib><creatorcontrib>Xu Cheng-Bai</creatorcontrib><creatorcontrib>Lee Choong-Bong</creatorcontrib><creatorcontrib>Andes Cecily</creatorcontrib><title>Photoresist overcoat compositions</title><description>Photoresist overcoat compositions are provided. The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition. The compositions have particular applicability in the semiconductor manufacturing industry for use in negative tone development processes.</description><subject>ADHESIVES</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTROGRAPHY</subject><subject>FILLING PASTES</subject><subject>HOLOGRAPHY</subject><subject>INKS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORIGINALS THEREFOR</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAMyMgvyS9KLc4sLlHIL0stSs5PLFFIzs8tyC_OLMnMzyvmYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocGWphaGlgYmTkbGRCgBAJWoJlA</recordid><startdate>20170228</startdate><enddate>20170228</enddate><creator>DeSisto Jason A</creator><creator>Liu Cong</creator><creator>Park Jong Keun</creator><creator>Caporale Stefan J</creator><creator>Xu Cheng-Bai</creator><creator>Lee Choong-Bong</creator><creator>Andes Cecily</creator><scope>EVB</scope></search><sort><creationdate>20170228</creationdate><title>Photoresist overcoat compositions</title><author>DeSisto Jason A ; Liu Cong ; Park Jong Keun ; Caporale Stefan J ; Xu Cheng-Bai ; Lee Choong-Bong ; Andes Cecily</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9581904B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>ADHESIVES</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTROGRAPHY</topic><topic>FILLING PASTES</topic><topic>HOLOGRAPHY</topic><topic>INKS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORIGINALS THEREFOR</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>DeSisto Jason A</creatorcontrib><creatorcontrib>Liu Cong</creatorcontrib><creatorcontrib>Park Jong Keun</creatorcontrib><creatorcontrib>Caporale Stefan J</creatorcontrib><creatorcontrib>Xu Cheng-Bai</creatorcontrib><creatorcontrib>Lee Choong-Bong</creatorcontrib><creatorcontrib>Andes Cecily</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DeSisto Jason A</au><au>Liu Cong</au><au>Park Jong Keun</au><au>Caporale Stefan J</au><au>Xu Cheng-Bai</au><au>Lee Choong-Bong</au><au>Andes Cecily</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photoresist overcoat compositions</title><date>2017-02-28</date><risdate>2017</risdate><abstract>Photoresist overcoat compositions are provided. The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition. The compositions have particular applicability in the semiconductor manufacturing industry for use in negative tone development processes.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Photoresist overcoat compositions |
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