Data center thermal monitoring

A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component is received. A second measurement indicative of a temperature of a second computing component is received. A thermal value is calculated for...

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Bibliographische Detailangaben
Hauptverfasser:	Imwalle Gregory P, Stiver David W
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING CONTROLLING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS PRINTED CIRCUITS REGULATING SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:	A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component is received. A second measurement indicative of a temperature of a second computing component is received. A thermal value is calculated for the first computing component based on the first measurement and the second measurement. In response to determining that the calculated thermal value exceeds the threshold, an operational or physical parameter of the system is modified.