Method of making integrated circuit

Methods of fabricating integrated circuits are disclosed herein. A die having a side is provided. A conductive stud extends from the side in a direction that is substantially normal to the side. A first dielectric layer is affixed to the side of the die. The first dielectric layer has a first side a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Gallegos Bernardo, Castro Abram
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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