Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	McLellan Neil, Kwan Kin Pui, Fan Chun Ho, de Munnik Walter, Lau Wing Him, Tsang Kwok Cheung, Lin Geraldine Tsui Yee
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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