Microfluidic sensor package structure and method
In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Kim Byong Jin Na Do Hyun Lee Yung Woo Jeon Hyung II Lee Jae Ung Hwang Chan Ha Chung Ji Young |
| description | In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9513254B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9513254B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9513254B23</originalsourceid><addsrcrecordid>eNrjZDDwzUwuyk_LKc1MyUxWKE7NK84vUihITM5OTE9VKC4pKk0uKS1KVUjMS1HITS3JyE_hYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxUCtqXmpJfGhwZamhsZGpiZORsZEKAEAOpQraA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Microfluidic sensor package structure and method</title><source>esp@cenet</source><creator>Kim Byong Jin ; Na Do Hyun ; Lee Yung Woo ; Jeon Hyung II ; Lee Jae Ung ; Hwang Chan Ha ; Chung Ji Young</creator><creatorcontrib>Kim Byong Jin ; Na Do Hyun ; Lee Yung Woo ; Jeon Hyung II ; Lee Jae Ung ; Hwang Chan Ha ; Chung Ji Young</creatorcontrib><description>In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161206&DB=EPODOC&CC=US&NR=9513254B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161206&DB=EPODOC&CC=US&NR=9513254B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim Byong Jin</creatorcontrib><creatorcontrib>Na Do Hyun</creatorcontrib><creatorcontrib>Lee Yung Woo</creatorcontrib><creatorcontrib>Jeon Hyung II</creatorcontrib><creatorcontrib>Lee Jae Ung</creatorcontrib><creatorcontrib>Hwang Chan Ha</creatorcontrib><creatorcontrib>Chung Ji Young</creatorcontrib><title>Microfluidic sensor package structure and method</title><description>In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwzUwuyk_LKc1MyUxWKE7NK84vUihITM5OTE9VKC4pKk0uKS1KVUjMS1HITS3JyE_hYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxUCtqXmpJfGhwZamhsZGpiZORsZEKAEAOpQraA</recordid><startdate>20161206</startdate><enddate>20161206</enddate><creator>Kim Byong Jin</creator><creator>Na Do Hyun</creator><creator>Lee Yung Woo</creator><creator>Jeon Hyung II</creator><creator>Lee Jae Ung</creator><creator>Hwang Chan Ha</creator><creator>Chung Ji Young</creator><scope>EVB</scope></search><sort><creationdate>20161206</creationdate><title>Microfluidic sensor package structure and method</title><author>Kim Byong Jin ; Na Do Hyun ; Lee Yung Woo ; Jeon Hyung II ; Lee Jae Ung ; Hwang Chan Ha ; Chung Ji Young</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9513254B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim Byong Jin</creatorcontrib><creatorcontrib>Na Do Hyun</creatorcontrib><creatorcontrib>Lee Yung Woo</creatorcontrib><creatorcontrib>Jeon Hyung II</creatorcontrib><creatorcontrib>Lee Jae Ung</creatorcontrib><creatorcontrib>Hwang Chan Ha</creatorcontrib><creatorcontrib>Chung Ji Young</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim Byong Jin</au><au>Na Do Hyun</au><au>Lee Yung Woo</au><au>Jeon Hyung II</au><au>Lee Jae Ung</au><au>Hwang Chan Ha</au><au>Chung Ji Young</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Microfluidic sensor package structure and method</title><date>2016-12-06</date><risdate>2016</risdate><abstract>In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US9513254B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS SEMICONDUCTOR DEVICES TESTING TRANSPORTING |
| title | Microfluidic sensor package structure and method |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T15%3A32%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim%20Byong%20Jin&rft.date=2016-12-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9513254B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |