Method of manufacturing semiconductor device

To provide a semiconductor device having improved performance while improving the throughput in the manufacturing steps of the semiconductor device. An insulating film portion comprised of first, second, third, fourth, and fifth insulating films is formed on a semiconductor substrate. The second ins...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yamakoshi Hideaki, Yoshida Shoji, Abe Shinichiro, Owada Fukuo, Muranaka Seiji, Kudo Toshio, Okada Daisuke, Yamabe Kazuharu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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