Method of operating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product
A reticle is loaded into a lithographic apparatus. The apparatus performs measurements on the reticle, so as to calculate alignment parameters for transferring the pattern accurately to substrates. Tests are performed to detect possible contamination of the reticle or its support. Either operation p...
Gespeichert in:
| Hauptverfasser: | , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Luehrmann Paul Frank Schmitt-Weaver Emil Peter Slotboom Daan Maurits Van Damme Jean-Philippe Xavier Henke Wolfgang Boon Eduardus Johannes Gerardus Ypma Alexander Kea Marc Jurian |
| description | A reticle is loaded into a lithographic apparatus. The apparatus performs measurements on the reticle, so as to calculate alignment parameters for transferring the pattern accurately to substrates. Tests are performed to detect possible contamination of the reticle or its support. Either operation proceeds with a warning, or the patterning of substrates is stopped. The test uses may use parameters of the alignment model itself, or different parameters. The integrity parameters may be compared against reference values reflecting historic measurements, so that sudden changes in a parameter are indicative of contamination. Integrity parameters may be calculated from residuals of the alignment model. In an example, height residuals are used to calculate parameters of residual wedge (Rx′) and residual roll (Ryy′). From these, integrity parameters expressed as height deviations are calculated and compared against thresholds. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9507279B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9507279B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9507279B23</originalsourceid><addsrcrecordid>eNqNjT0KwkAQhdNYiHqHOYCCRCSkVRQbK7UOw-wkWcjuDvvjNbyym6i9xfDgvY9v5sXryrF3ClwLTthj1LYDhEHntvMovSZAEcxLCmtQ_NTEYNCmFikmP-Lmo0CbLwRHGiMrUBgRxDviECbpzzKB5IykyH4k8h8zpkoUl8WsxSHw6puLAs6n-_GyYXENB0Fiy7F53Or9tiqr-lDu_kDeIE9PzA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of operating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product</title><source>esp@cenet</source><creator>Luehrmann Paul Frank ; Schmitt-Weaver Emil Peter ; Slotboom Daan Maurits ; Van Damme Jean-Philippe Xavier ; Henke Wolfgang ; Boon Eduardus Johannes Gerardus ; Ypma Alexander ; Kea Marc Jurian</creator><creatorcontrib>Luehrmann Paul Frank ; Schmitt-Weaver Emil Peter ; Slotboom Daan Maurits ; Van Damme Jean-Philippe Xavier ; Henke Wolfgang ; Boon Eduardus Johannes Gerardus ; Ypma Alexander ; Kea Marc Jurian</creatorcontrib><description>A reticle is loaded into a lithographic apparatus. The apparatus performs measurements on the reticle, so as to calculate alignment parameters for transferring the pattern accurately to substrates. Tests are performed to detect possible contamination of the reticle or its support. Either operation proceeds with a warning, or the patterning of substrates is stopped. The test uses may use parameters of the alignment model itself, or different parameters. The integrity parameters may be compared against reference values reflecting historic measurements, so that sudden changes in a parameter are indicative of contamination. Integrity parameters may be calculated from residuals of the alignment model. In an example, height residuals are used to calculate parameters of residual wedge (Rx′) and residual roll (Ryy′). From these, integrity parameters expressed as height deviations are calculated and compared against thresholds.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161129&DB=EPODOC&CC=US&NR=9507279B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161129&DB=EPODOC&CC=US&NR=9507279B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Luehrmann Paul Frank</creatorcontrib><creatorcontrib>Schmitt-Weaver Emil Peter</creatorcontrib><creatorcontrib>Slotboom Daan Maurits</creatorcontrib><creatorcontrib>Van Damme Jean-Philippe Xavier</creatorcontrib><creatorcontrib>Henke Wolfgang</creatorcontrib><creatorcontrib>Boon Eduardus Johannes Gerardus</creatorcontrib><creatorcontrib>Ypma Alexander</creatorcontrib><creatorcontrib>Kea Marc Jurian</creatorcontrib><title>Method of operating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product</title><description>A reticle is loaded into a lithographic apparatus. The apparatus performs measurements on the reticle, so as to calculate alignment parameters for transferring the pattern accurately to substrates. Tests are performed to detect possible contamination of the reticle or its support. Either operation proceeds with a warning, or the patterning of substrates is stopped. The test uses may use parameters of the alignment model itself, or different parameters. The integrity parameters may be compared against reference values reflecting historic measurements, so that sudden changes in a parameter are indicative of contamination. Integrity parameters may be calculated from residuals of the alignment model. In an example, height residuals are used to calculate parameters of residual wedge (Rx′) and residual roll (Ryy′). From these, integrity parameters expressed as height deviations are calculated and compared against thresholds.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjT0KwkAQhdNYiHqHOYCCRCSkVRQbK7UOw-wkWcjuDvvjNbyym6i9xfDgvY9v5sXryrF3ClwLTthj1LYDhEHntvMovSZAEcxLCmtQ_NTEYNCmFikmP-Lmo0CbLwRHGiMrUBgRxDviECbpzzKB5IykyH4k8h8zpkoUl8WsxSHw6puLAs6n-_GyYXENB0Fiy7F53Or9tiqr-lDu_kDeIE9PzA</recordid><startdate>20161129</startdate><enddate>20161129</enddate><creator>Luehrmann Paul Frank</creator><creator>Schmitt-Weaver Emil Peter</creator><creator>Slotboom Daan Maurits</creator><creator>Van Damme Jean-Philippe Xavier</creator><creator>Henke Wolfgang</creator><creator>Boon Eduardus Johannes Gerardus</creator><creator>Ypma Alexander</creator><creator>Kea Marc Jurian</creator><scope>EVB</scope></search><sort><creationdate>20161129</creationdate><title>Method of operating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product</title><author>Luehrmann Paul Frank ; Schmitt-Weaver Emil Peter ; Slotboom Daan Maurits ; Van Damme Jean-Philippe Xavier ; Henke Wolfgang ; Boon Eduardus Johannes Gerardus ; Ypma Alexander ; Kea Marc Jurian</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9507279B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>Luehrmann Paul Frank</creatorcontrib><creatorcontrib>Schmitt-Weaver Emil Peter</creatorcontrib><creatorcontrib>Slotboom Daan Maurits</creatorcontrib><creatorcontrib>Van Damme Jean-Philippe Xavier</creatorcontrib><creatorcontrib>Henke Wolfgang</creatorcontrib><creatorcontrib>Boon Eduardus Johannes Gerardus</creatorcontrib><creatorcontrib>Ypma Alexander</creatorcontrib><creatorcontrib>Kea Marc Jurian</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Luehrmann Paul Frank</au><au>Schmitt-Weaver Emil Peter</au><au>Slotboom Daan Maurits</au><au>Van Damme Jean-Philippe Xavier</au><au>Henke Wolfgang</au><au>Boon Eduardus Johannes Gerardus</au><au>Ypma Alexander</au><au>Kea Marc Jurian</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of operating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product</title><date>2016-11-29</date><risdate>2016</risdate><abstract>A reticle is loaded into a lithographic apparatus. The apparatus performs measurements on the reticle, so as to calculate alignment parameters for transferring the pattern accurately to substrates. Tests are performed to detect possible contamination of the reticle or its support. Either operation proceeds with a warning, or the patterning of substrates is stopped. The test uses may use parameters of the alignment model itself, or different parameters. The integrity parameters may be compared against reference values reflecting historic measurements, so that sudden changes in a parameter are indicative of contamination. Integrity parameters may be calculated from residuals of the alignment model. In an example, height residuals are used to calculate parameters of residual wedge (Rx′) and residual roll (Ryy′). From these, integrity parameters expressed as height deviations are calculated and compared against thresholds.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US9507279B2 |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | Method of operating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T21%3A45%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Luehrmann%20Paul%20Frank&rft.date=2016-11-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9507279B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |