Method and system for wafer level singulation

A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Schuegraf Klaus, Salek Mohsen S, Bjorkman Claes H, Ramaswami Seshadri, Rice Michael R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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