RFID integrated circuits with contact islands
A Radio Frequency Identification (RFID) IC may have raised contact islands that include conductive contact pads covering a repassivation layer. The raised contact islands are formed by removing part or all of the repassivation material surrounding the raised contact islands. The repassivation materi...
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| creator | Wu Tan Mau Heinrich Harley K Diorio Christopher J Koepp Ronald L |
| description | A Radio Frequency Identification (RFID) IC may have raised contact islands that include conductive contact pads covering a repassivation layer. The raised contact islands are formed by removing part or all of the repassivation material surrounding the raised contact islands. The repassivation material that is not covered and protected by the contact pads may be removed by a strip process that also removes a masking layer used for IC etching. Singulated RFID ICs may be assembled into an RFID tag using a B-stage adhesive that is applied to the ICs and then partially cured. The ICs are deposited onto preheated inlays. The preheated inlays cause the B-stage adhesive on the ICs to bind to the inlays. |
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The raised contact islands are formed by removing part or all of the repassivation material surrounding the raised contact islands. The repassivation material that is not covered and protected by the contact pads may be removed by a strip process that also removes a masking layer used for IC etching. Singulated RFID ICs may be assembled into an RFID tag using a B-stage adhesive that is applied to the ICs and then partially cured. The ICs are deposited onto preheated inlays. The preheated inlays cause the B-stage adhesive on the ICs to bind to the inlays.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161115&DB=EPODOC&CC=US&NR=9495631B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161115&DB=EPODOC&CC=US&NR=9495631B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wu Tan Mau</creatorcontrib><creatorcontrib>Heinrich Harley K</creatorcontrib><creatorcontrib>Diorio Christopher J</creatorcontrib><creatorcontrib>Koepp Ronald L</creatorcontrib><title>RFID integrated circuits with contact islands</title><description>A Radio Frequency Identification (RFID) IC may have raised contact islands that include conductive contact pads covering a repassivation layer. 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The raised contact islands are formed by removing part or all of the repassivation material surrounding the raised contact islands. The repassivation material that is not covered and protected by the contact pads may be removed by a strip process that also removes a masking layer used for IC etching. Singulated RFID ICs may be assembled into an RFID tag using a B-stage adhesive that is applied to the ICs and then partially cured. The ICs are deposited onto preheated inlays. The preheated inlays cause the B-stage adhesive on the ICs to bind to the inlays.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS |
| title | RFID integrated circuits with contact islands |
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