Forming die assembly for microcomponents

A forming die assembly for microcomponents includes a forming die and a punch. The forming die is formed with a cavity, a punch hole connected to the cavity, and a supply path for supplying a raw material with a metal powder and a binder having plasticity. The supply path is connected to the cavity...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Murasugi Narutoshi, Maekawa Kazunori, Ishijima Zenzo
Format: Patent
Sprache:eng
Schlagworte:
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