Apparatus and system for attaching integral spacers to laminations

Disclosed are methods, apparatuses, and systems with regard to laminations. In an embodiment, an apparatus includes a lamination having a variable thickness and a spacer connected with the lamination at a location, wherein the location of the spacer is based on a determined thickness of the laminati...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Dorsey David Norwood, Luo Yuefeng, Adis William Edward, Richardson Christopher
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Disclosed are methods, apparatuses, and systems with regard to laminations. In an embodiment, an apparatus includes a lamination having a variable thickness and a spacer connected with the lamination at a location, wherein the location of the spacer is based on a determined thickness of the lamination.