Methods for transparent encapsulation and selective encapsulation
The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Mayo Sean A Ness Trevor J Pennathur Shankar S Foster James H |
| description | The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9485870B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9485870B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9485870B23</originalsourceid><addsrcrecordid>eNrjZHD0TS3JyE8pVkjLL1IoKUrMKy5ILErNK1FIzUtOLCguzUksyczPU0jMS1EoTs1JTS7JLEtFleNhYE1LzClO5YXS3AwKbq4hzh66qQX58alA45JT81JL4kODLU0sTC3MDZyMjIlQAgAUhDJ8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Methods for transparent encapsulation and selective encapsulation</title><source>esp@cenet</source><creator>Mayo Sean A ; Ness Trevor J ; Pennathur Shankar S ; Foster James H</creator><creatorcontrib>Mayo Sean A ; Ness Trevor J ; Pennathur Shankar S ; Foster James H</creatorcontrib><description>The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161101&DB=EPODOC&CC=US&NR=9485870B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161101&DB=EPODOC&CC=US&NR=9485870B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Mayo Sean A</creatorcontrib><creatorcontrib>Ness Trevor J</creatorcontrib><creatorcontrib>Pennathur Shankar S</creatorcontrib><creatorcontrib>Foster James H</creatorcontrib><title>Methods for transparent encapsulation and selective encapsulation</title><description>The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0TS3JyE8pVkjLL1IoKUrMKy5ILErNK1FIzUtOLCguzUksyczPU0jMS1EoTs1JTS7JLEtFleNhYE1LzClO5YXS3AwKbq4hzh66qQX58alA45JT81JL4kODLU0sTC3MDZyMjIlQAgAUhDJ8</recordid><startdate>20161101</startdate><enddate>20161101</enddate><creator>Mayo Sean A</creator><creator>Ness Trevor J</creator><creator>Pennathur Shankar S</creator><creator>Foster James H</creator><scope>EVB</scope></search><sort><creationdate>20161101</creationdate><title>Methods for transparent encapsulation and selective encapsulation</title><author>Mayo Sean A ; Ness Trevor J ; Pennathur Shankar S ; Foster James H</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9485870B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>Mayo Sean A</creatorcontrib><creatorcontrib>Ness Trevor J</creatorcontrib><creatorcontrib>Pennathur Shankar S</creatorcontrib><creatorcontrib>Foster James H</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mayo Sean A</au><au>Ness Trevor J</au><au>Pennathur Shankar S</au><au>Foster James H</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods for transparent encapsulation and selective encapsulation</title><date>2016-11-01</date><risdate>2016</risdate><abstract>The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US9485870B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | Methods for transparent encapsulation and selective encapsulation |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T11%3A53%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Mayo%20Sean%20A&rft.date=2016-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9485870B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |