Electronic device comprising an optical sensor chip
An electronic device includes a substrate plate with a traversing passage. An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip fa...
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creator | Coffy Romain Pruvost Julien |
description | An electronic device includes a substrate plate with a traversing passage. An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip facing the substrate plate such that the protective plate is engaged with the traversing passage. Electrical connection elements extend between the chip and the substrate plate. An internal block of encapsulation material extends into the traversing passage of the substrate plate between the chip and the substrate plate so as to embed the electrical connection elements. |
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An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip facing the substrate plate such that the protective plate is engaged with the traversing passage. Electrical connection elements extend between the chip and the substrate plate. 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An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip facing the substrate plate such that the protective plate is engaged with the traversing passage. Electrical connection elements extend between the chip and the substrate plate. An internal block of encapsulation material extends into the traversing passage of the substrate plate between the chip and the substrate plate so as to embed the electrical connection elements.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB2zUlNLinKz8tMVkhJLctMTlVIzs8tKMoszsxLV0jMU8gvKMlMTsxRKE7NK84vUkjOyCzgYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocGWJuYWZubmTkbGRCgBAL_1LHg</recordid><startdate>20161025</startdate><enddate>20161025</enddate><creator>Coffy Romain</creator><creator>Pruvost Julien</creator><scope>EVB</scope></search><sort><creationdate>20161025</creationdate><title>Electronic device comprising an optical sensor chip</title><author>Coffy Romain ; Pruvost Julien</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9478677B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Coffy Romain</creatorcontrib><creatorcontrib>Pruvost Julien</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Coffy Romain</au><au>Pruvost Julien</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic device comprising an optical sensor chip</title><date>2016-10-25</date><risdate>2016</risdate><abstract>An electronic device includes a substrate plate with a traversing passage. An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip facing the substrate plate such that the protective plate is engaged with the traversing passage. Electrical connection elements extend between the chip and the substrate plate. An internal block of encapsulation material extends into the traversing passage of the substrate plate between the chip and the substrate plate so as to embed the electrical connection elements.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Electronic device comprising an optical sensor chip |
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