Inspection apparatus and inspection method for inspecting a wiring board

An inspection apparatus for inspecting a wiring board having an opposing electrode facing an upper face of the wiring board, a capacitance meter electrically connected to the opposing electrode and the multi-layer wiring, and measuring capacitance between the opposing electrode and the multi-layer wiring, ground, a switch box that is connected to the ground wirings, the opposing electrode, and the ground, and switches to select between a first connection state, in which all the ground wirings are electrically connected to the opposing electrode, and a second connection state, in which one ground wiring is electrically connected to the ground. A control unit extracts a capacitance value by calculating difference between a first capacitance and a second capacitance, wherein capacitance in units of layers of the multi-layer wiring are measured based on the capacitance value extracted by the control unit.