Integrated circuit chip and fabrication method

An integrated circuit chip includes a substrate die and integrated circuits and a layer incorporating a front electrical interconnect network formed on a front face of the substrate die. A local electrical connection via made of an electrically conductive material is formed in a hole of the substrat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chapelon Laurent-Luc, Cuzzocrea Julien
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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