Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures

A method for selecting locations within an integrated circuit device for placing stressors to manage electromigration failures includes calculating an electric current for an interconnect within the integrated circuit device and determining an electromigration stress profile for the interconnect bas...

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Bibliographische Detailangaben
Hauptverfasser: Reber Douglas M, Travis Edward O, Shroff Mehul D
Format: Patent
Sprache:eng
Schlagworte:
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