Semiconductor wafer, semiconductor IC chip and manufacturing method of the same

A semiconductor wafer includes circuit integration regions each incorporating an integrated circuit and guard rings disposed to surround the circuit integration regions, respectively. A scribe region disposed between every adjacent two of the guard rings. An element and a pad electrically connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kumagai Yasuhiro, Nakamura Hisao, Nakagomi Yuichi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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