Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

A semiconductor device according to the present invention has a semiconductor module 2; a cooling unit 3, the semiconductor module 2 being joined to an upper surface of the cooling unit 3, and a pipe 14, 15 for circulating a refrigerant being fixed to a side surface 20, 22 of the cooling unit 3; and...

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Hauptverfasser: Kobayashi Hideki, Yoshihara Toshikazu, Tamagawa Satoshi, Oi Yasuyuki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Kobayashi Hideki
Yoshihara Toshikazu
Tamagawa Satoshi
Oi Yasuyuki
description A semiconductor device according to the present invention has a semiconductor module 2; a cooling unit 3, the semiconductor module 2 being joined to an upper surface of the cooling unit 3, and a pipe 14, 15 for circulating a refrigerant being fixed to a side surface 20, 22 of the cooling unit 3; and a resin mold layer 4 that covers outer peripheries of the semiconductor module 2 and the cooling unit 3. Further, a protruding portion 25, 26 that protrudes from the side surface 20, 22 of the cooling unit 3 and surrounds the pipe 14, 15 is provided on the side surface 20, 22 of the cooling unit 3.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device and method for manufacturing semiconductor device
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