Methods of producing integrated circuits with an air gap

Integrated circuits and methods for producing the same are provided. A method for producing an integrated circuit includes forming an interconnect trench in a dielectric layer, and forming a conformal barrier layer overlying the dielectric layer and within the interconnect trench. A barrier spacer i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ryan Errol Todd, Zhao Larry, Child Craig, He Ming, Augur Roderick Alan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!