Wire bond through-via structure and method

A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Pepe Angel, Boyd W. Eric, Yamaguchi James, Bindrup Randy, Leon John
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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