Conductive substrate comprising a metal fine particle sintered film

Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conduct...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yoshi Naonobu, Hojo Mikiko
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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