Optoelectronic component and method for producing an opto-electronic component

An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is el...

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Bibliographische Detailangaben
Hauptverfasser: Wirth Ralph, Kaltenbacher Axel, Stath Norbert, Barchmann Bernd, Wegleiter Walter, Weidner Karl
Format: Patent
Sprache:eng
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Zusammenfassung:An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is electrically conductively connected to the contact region (10) by way of an unsupported conductive structure (13). A method for manufacturing an opto-electronic component is described.