Packaged microelectronic components

A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the enc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chan Min Yu, Ser Bok Leng, Chia Yong Poo, Zhou Wei, Low Sui Waf, Eng Meow Koon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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