Copper wiring forming method with Ru liner and Cu alloy fill

Provided is a method of forming a copper (Cu) wiring in a recess formed to have a predetermined pattern in an insulating film formed on a surface of a substrate. The method includes: forming a barrier film at least on a surface of the recess, the barrier film serving as a barrier for blocking diffus...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sakuma Takashi, Yokoyama Osamu, Suzuki Kenji, Han Cheonsoo, Ishizaka Tadahiro, Yasumuro Chiaki, Hirasawa Tatsuo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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