Semiconductor wafer and method of fabricating an IC die

Semiconductor wafer and method of fabricating an IC die

There is provided a semiconductor wafer comprising a plurality of replicated IC modules. Each replicated IC module is capable of forming an individual IC die. The semiconductor wafer further comprises inter-module cross-wafer electrical connections, and the replicated IC modules are further arranged...

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Hauptverfasser: Maiolani Mark, Moran Robert F, Beattie Derek
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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creator Maiolani Mark
Moran Robert F
Beattie Derek
description There is provided a semiconductor wafer comprising a plurality of replicated IC modules. Each replicated IC module is capable of forming an individual IC die. The semiconductor wafer further comprises inter-module cross-wafer electrical connections, and the replicated IC modules are further arranged to be cut into IC dies comprising multiple replicated IC modules. There is further provided a method of fabricating an IC die. The method comprises fabricating such a semiconductor wafer, determining a required configuration of replicated IC modules, identifying inter-module boundaries along which to cut the semiconductor wafer to achieve the required configuration of replicated IC modules, and cutting the semiconductor wafer along the identified inter-module boundaries to produce at least one IC die comprising the required configuration of replicated IC modules.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
title Semiconductor wafer and method of fabricating an IC die
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