Semiconductor device
A semiconductor device includes a package substrate having a plurality of external connection terminals disposed on a first surface thereof and a plurality of internal connection terminals disposed on a second surface thereof and electrically connected with corresponding one of the external connecti...
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| creator | YOON SEOKOL SHIM SEOK-BO |
| description | A semiconductor device includes a package substrate having a plurality of external connection terminals disposed on a first surface thereof and a plurality of internal connection terminals disposed on a second surface thereof and electrically connected with corresponding one of the external connection terminals, a first semiconductor chip stacked over the second surface of the package substrate and having a first flag pad for providing first information and a first internal circuit for adjusting a parameter by a first correction value in response to the first information provided from the first flag pad, and a second semiconductor chip stacked over the first semiconductor chip and having a second flag pad for providing second information and a second internal circuit for adjusting the parameter by a second correction value in response to the second information provided from the second flag pad. |
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BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; STATIC STORES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160719&DB=EPODOC&CC=US&NR=9397672B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160719&DB=EPODOC&CC=US&NR=9397672B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOON SEOKOL</creatorcontrib><creatorcontrib>SHIM SEOK-BO</creatorcontrib><title>Semiconductor device</title><description>A semiconductor device includes a package substrate having a plurality of external connection terminals disposed on a first surface thereof and a plurality of internal connection terminals disposed on a second surface thereof and electrically connected with corresponding one of the external connection terminals, a first semiconductor chip stacked over the second surface of the package substrate and having a first flag pad for providing first information and a first internal circuit for adjusting a parameter by a first correction value in response to the first information provided from the first flag pad, and a second semiconductor chip stacked over the first semiconductor chip and having a second flag pad for providing second information and a second internal circuit for adjusting the parameter by a second correction value in response to the second information provided from the second flag pad.</description><subject>AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATIONOF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INFORMATION STORAGE</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STATIC STORES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJTs3NTM7PSylNLskvUkhJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwZbGluZm5kZORsZEKAEAJ_sg0g</recordid><startdate>20160719</startdate><enddate>20160719</enddate><creator>YOON SEOKOL</creator><creator>SHIM SEOK-BO</creator><scope>EVB</scope></search><sort><creationdate>20160719</creationdate><title>Semiconductor device</title><author>YOON SEOKOL ; 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| language | eng |
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| subjects | AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATIONOF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES STATIC STORES |
| title | Semiconductor device |
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