Method for testing semiconductor chips or semiconductor chip modules

A semiconductor chip panel includes a plurality of semiconductor chips embedded in an encapsulation material. At least part of the semiconductor chips comprise a first electrical contact element on a first main face and a second electrical contact element on a second main opposite to the first main...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUERGUT EDWARD, GROENINGER HORST
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
Online-Zugang:	Volltext bestellen
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