Semiconductor chip and stacked type semiconductor package having the same

The disclosure relates to a semiconductor chip and a stacked type semiconductor package having the same. The semiconductor chip includes: a semiconductor chip body having a first surface formed with a plurality of bonding pads and a second surface which is opposite to the first surface, a plurality...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE BYOUNG DO, SON JAE HYUN, CHOI WOONG KYU, KIM JONG HOON, CHUN KUK JIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!