Semiconductor device with bumps and display device module incorporating the same

A semiconductor device includes: a semiconductor chip having a main face which has a pair of long sides parallel to each other and a pair of short sides orthogonal to the pair of long sides; first bumps arrayed in a first bump placement region of the semiconductor chip, the first bump placement regi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA HISAO, NAKAGOMI YUICHI, SUZUKI SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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