Radio frequency shielding within a semiconductor package
Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.
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| creator | GOETZ EDMUND MEMMLER BERND MUELLER JAN-ERIK BAUMGARTNER PETER |
| description | Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9362233B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9362233B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9362233B23</originalsourceid><addsrcrecordid>eNrjZLAISkzJzFdIK0otLE3NS65UKM7ITM1JycxLVyjPLMnIzFNIVChOzc1Mzs9LKU0uyS9SKEhMzk5MT-VhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQFWpeakl8aHBlsZmRkbGxk5GxkQoAQDWtS5g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Radio frequency shielding within a semiconductor package</title><source>esp@cenet</source><creator>GOETZ EDMUND ; MEMMLER BERND ; MUELLER JAN-ERIK ; BAUMGARTNER PETER</creator><creatorcontrib>GOETZ EDMUND ; MEMMLER BERND ; MUELLER JAN-ERIK ; BAUMGARTNER PETER</creatorcontrib><description>Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160607&DB=EPODOC&CC=US&NR=9362233B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160607&DB=EPODOC&CC=US&NR=9362233B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOETZ EDMUND</creatorcontrib><creatorcontrib>MEMMLER BERND</creatorcontrib><creatorcontrib>MUELLER JAN-ERIK</creatorcontrib><creatorcontrib>BAUMGARTNER PETER</creatorcontrib><title>Radio frequency shielding within a semiconductor package</title><description>Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAISkzJzFdIK0otLE3NS65UKM7ITM1JycxLVyjPLMnIzFNIVChOzc1Mzs9LKU0uyS9SKEhMzk5MT-VhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQFWpeakl8aHBlsZmRkbGxk5GxkQoAQDWtS5g</recordid><startdate>20160607</startdate><enddate>20160607</enddate><creator>GOETZ EDMUND</creator><creator>MEMMLER BERND</creator><creator>MUELLER JAN-ERIK</creator><creator>BAUMGARTNER PETER</creator><scope>EVB</scope></search><sort><creationdate>20160607</creationdate><title>Radio frequency shielding within a semiconductor package</title><author>GOETZ EDMUND ; MEMMLER BERND ; MUELLER JAN-ERIK ; BAUMGARTNER PETER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9362233B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GOETZ EDMUND</creatorcontrib><creatorcontrib>MEMMLER BERND</creatorcontrib><creatorcontrib>MUELLER JAN-ERIK</creatorcontrib><creatorcontrib>BAUMGARTNER PETER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOETZ EDMUND</au><au>MEMMLER BERND</au><au>MUELLER JAN-ERIK</au><au>BAUMGARTNER PETER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Radio frequency shielding within a semiconductor package</title><date>2016-06-07</date><risdate>2016</risdate><abstract>Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Radio frequency shielding within a semiconductor package |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T12%3A13%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GOETZ%20EDMUND&rft.date=2016-06-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9362233B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |